IEEE

An Experimental Study on a Barrier-Less Cu Interconnect Scheme With Polyimide Insulator for Cost-Effective 3-D Packaging

Abstract: Polyimide (PI) has been widely used as the insulator material in the Cu interconnect system for 3-D advanced packaging. In general, a barrier layer is required between PI and Cu to suppress ...
Computer Weekly

IOWN advances next-generation network evolution and innovation

Ending a year in which it celebrated its fifth birthday, the Innovative Optical and Wireless Network project releases details ...

Lumentum Stock Rides on Strong AI Push: A Sign of More Upside?

AI-driven demand is fueling LITE's laser chips and optical transceivers, with over 60% of revenues tied to AI infrastructure and cloud growth.

Nasstar Taps Ribbon to Power UK Voice Network Transformation for Cloud Era

Ribbon Communications Inc. (Nasdaq: RBBN), a global leader in real-time communications technology and IP optical networking solutions, today announced a strategic collaboration with UK distributor ...
IEEE

Carbon Nanotube Interconnect Optimizations With Bayesian Neural Network and Bayesian Optimization

Abstract: As Cu interconnects near their physical limits with continued technology scaling, carbon nanotube (CNT) interconnects have emerged as a promising alternative due to their excellent ...