Abstract: Silicon wafer thinning is mostly performed by self-rotating grinding process. In grinding, the grinding force is a crucial factor of affecting the machining accuracy and surface/subsurface ...
Under30CEO on MSNOpinion
Why founders who do private journaling outperform those who just grind
At some point, every founder hits the wall where effort stops compounding. You are working longer hours, saying yes to ...
Abstract: The paper involved conducting preliminary research to explore the identification and control of a multi-dimensional, non-linear, and non-stationary cement grinding process using artificial ...
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