Recently, a research team led by Academician Lijun Wang at CIOMP under UCAS has systematically reviewed the latest ...

Samsung Electronics is reportedly developing a new mobile chip packaging method aimed at improving thermal efficiency in its ...

Samsung Galaxy Z Flip 8 may feature the Exynos 2600 chip, promising better AI, efficiency, and performance. Can it rival ...

Why do bags of chips have a foil lining? In the food industry, packaging is very important. This packaging does three things: it protects against light, oxygen and moisture. Let’s ...

In current designs, both the DRAM and the HPB sit on top of the processor. That means the HPB mainly helps cool the CPU and GPU, while the memory — which also heats up under load — doesn’t benefit as ...

Find out CPO’s 2025 scorecard and what lies ahead for this optical interconnect technology in 2026 and beyond.