A new technical paper titled “Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via ...

Abstract: Objective: The normal displacement, pore pressure and strain of different layers for articular cartilage were obtained with different compressive strains and rolling rates by finite element ...

Even with simulation, critical failure modes like resonance-induced fatigue and connection looseness can emerge during ...

Abstract: Objective: This study aims to evaluate the safety and efficacy of the custom 3D printed cervical pillow for the treatment of mechanical cervical spondylosis using the finite element method.