Researchers in Japan have developed an effective encapsulation with a PET front cover for copper indium gallium diselenide mini-modules. The lab devices withstood damp heat tests, retaining ...
A team led by Professor Guosheng Tang from Guangzhou Medical University, Associate Professor Yutao Liu from Tianjin University, and Professor Bin Liu ...
Abstract: FHE platforms need flexible encapsulation for protection from use stresses of flexing, folding, flex-to-install while allowing for integration with the intended packaging architectures.
School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, People’s Republic of China ...
Abstract: Under the prosperity of the global electronics industry, the current market requires consumer products, such as smartphones, notebook computers, tablet computers, and other portable ...
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